Microsemi extends life of Multichip Memory Device for OMAP processors
Microsemi's Extended Life Program (ELP) supports the TI (OMAP) memory family with extended life availability for devices that are EOL – namely the 152 bump package. Providing both LPDDR and LPDDR + flash, Microsemi serves this market with components compatible with PoP OMAP processors. Customers will benefit from a drop in replacement therefore removing the need to redesign the board or make software modifications:
Part Number | NAND Density | NAND Width | LPDDR Density | LPDDR Width | Volt | Package | Temp |
|---|---|---|---|---|---|---|---|
MS29C2G24MAKLA1-XX | 2Gb | X16 | 1Gb | X32 | 1.8 | 152 PBGA, 14mm x 14mm | I,C |
MS29C4G48MAZAPA1-XX | 4Gb | X16 | 2Gb | X32 | 1.8 | 152 PBGA, 14mm x 14mm | I,C |
MS46H64M32LP1-XX | -- | -- | 2Gb | X32 | 1.8 | 152 PBGA, 14mm x 14mm | I,C |