White Electronic Designs Corporation has introduced a secure Single Level Cell (SLC) NAND SSD that provides compact, secure and reliable data storage for embedded military applications in rugged and extended temp environments. The product is available as a 4GByte, 22mm x 27mm plastic ball grid array (PBGA) package and supports various PATA interface protocols. A hardware and software triggered security erase feature provides enhanced security for demanding military requirements and assurance that critical data at rest will be removed promptly when required. After the data purge command is initiated, all data is eliminated in less than 10 seconds and options are available that also perform sanitization protocols designed to be compliant to the various government agency specifications, such as NAVSO P-5239-26, AR380-19, AFSSI-5020, NSA-130-2 and NISPOM DoD 5220.22-M. This product provides highly reliable extended temperature environment operation for applications such as those used in aircraft, communications and missiles.

The COTS device delivers the functionality of data purge and sanitization enabling designers to create a single embedded design with a scalable security offering. An alternate standard NAND BGA without security is also available in the same footprint.

Constructed using a 32-bit RISC processor as its core storage controller, this SSD provides all the important flash management techniques for delivering a highly reliable solution. Incorporated wear levelling and error correction techniques extend disk operating life. The device provides data protection in the event of a sudden unplanned power loss or disturbance and operates from a single 3.3-volt power supply. With its SLC NAND-based storage technology, it delivers significantly higher performance than many other embedded form factor SSDs produced for the general market. SLC flash-based solutions provide approximately ten times more write/erase cycles than those with Multi Level Cell (MLC) flash devices, thus resulting in the further extension of disk life performance.

The PBGA package is constructed using eutectic tin-lead solder balls on a 1.27mm pitch with strategically placed signals to extend device life in harsh environments. It supports ATA/PCMCIA 2.1, compact flash 3.0 and 4.0 compliant interfaces. Additionally, the PBGA saves 150mm2 board space compared to an equivalent discrete design.