The new uPA2350 and uPA2351 Power MOSFET reduce the design footprint of traditional dual N-channel MOSFET for battery protection applications by as much as 86% compared to current industry solutions such as the 8-pin thin shrink small-outline package (TSSOP) traditionally used, and are ideal for use in lithium-ion battery packs for portable battery-powered applications such as portable power tools, medical pumps, dataloggers and other mobile wireless devices.

As one of the world's leading supplier of PowerMOSFET for rechargeable lithium-ion batteries, NEC is continually looking for ways to reduce the size of this type of battery to make portable devices smaller and more attractive to consumers.

An innovative use of chipscale packaging technology allowed NEC to develop MOSFET that have the industry's lowest on-state resistance and smallest package to address the stringent battery power and performance requirements of evolving portable consumer electronics products.

The devices combine NEC fourth-generation UMOS process technology with a chip-on-board packaging technique that results in low on-state resistances of 28 milliohms (uPA2350) and 32 milliohms (uPA2351) to extend battery life.

The devices are housed in the industry's smallest and thinnest package in their class, 1.62 millimeters (mm) square by 0.48 mm thick, which can reduce the size of battery. Integrated gate-protection diodes result in lower overall system costs and smaller form factors.