Technology Gateways
- Analog
- Audio / Video
- Bus I/O, Interface & Peripherals
- FPGA / CPLD / ASIC
- MCU
- Memory
- Military / Hi-Rel / Aerospace
RF and Wireless Solutions- ASSPs & Displays
- Hi-Rel Analog
- Hi-Rel Passives-on-Silicon
- Hi-Rel Sensors
- Hi-Rel Serial Comms
- MCUs and Digital Logic
- Memories
- Power Devices
- Programmable (FPGA / CPLD etc)
- RF Components
- Voltage & Sine Wave References
- MPU
- Opto
- Power
- Timing
- Wired Communications
- Wireless Communications / RF
- RF and Wireless Solutions
- Accessories
- Bluetooth & Bluetooth Low Energy
- Filters
- FM Band
- GPS
- GSM / GPRS / UMTS / HSDPA
- ISM
- Passives-on-Silicon
- RF & MW Components
- RF Amplifiers
- WiMAX
- WLAN
- Zigbee
Company Overview
IPDiA was founded on June 1st 2009, based on more than 10 years of Research and Development carried out at Philips and NXP - which led to the invention of innovative 3D technologies to integrate Passive Devices on Silicon.
IPDiA's primary focus is on two main axis: Passive Integrated Devices for new markets such as medical, industrial, aerospace and defense, and Integrated Devices for high brightness LEDs.
Products
RF Passive Integrated Devices: state of the art for wireless applications
IPDiA has developed a line of Passive Integrated Devices that operate over a band from DC to 100 GHz, covering mobile communication (GSM, WCDMA, LTE) as well as UWB, WLAN (WiFi™) and Radar requirements.
Thanks to the PICS (Passive Integrated Components on Silicon) technology, a wide variety of passive devices, such as baluns, couplers, splitters, filters and diplexers are integrated on a silicon substrate. Key components in this range, are the new ASPICS companion chipsets for Semtech’s ultra low power ISM-band RF transceiver, SX1211, making the total solution even less power hungry and much more optimized for RF performance (Application Specific Passives Integrated Components on Silicon).
Customized Products: from designing to manufacturing
IPDiA offers turnkey solutions, from design to manufacture of custom dies that match the application perfectly. The unique PICS technology is a highly efficient way of integrating tens or even hundreds of passive components such as resistors, capacitors, inductors and Zener diodes in a single silicon die.
3D Silicon Capacitors: World's record high density capacitance in silicon
IPDiA developed a unique technology to integrate a wide range of capacitor values on silicon. IPDiA High Density Silicon Capacitors bring unprecedented performance and considerably ease system integration through miniaturization. Silicon Capacitors can be used throughout a wide range of applications covering such diverse functions as power decoupling, signal coupling, pump charging, DC/DC power conversion.
They are particularly well suited for demanding environments in high reliability applications, with high operating temperature ranges.
Contact Details
For further information please contact ipdia@avnet-memec.eu